This industry research report presents market size and share of the semiconductor packaging and test market in China and segmentation by business type, including integrated devices manufacturer (IDM) and outsourced semiconductor assembly and test (OSAT). The report also discusses the key drivers influencing the growth of the market and a complete analysis of the top vendors operating in the market, including Amkor Technology, ASE, Powertech Technology, Siliconware Precision Industries (SPIL), STATS ChipPAC, and UTAC.
Technavio’s market research analysts estimate the semiconductor packaging and test market in China to grow at a healthy CAGR of 7% between 2015 and 2019. Growth in semiconductor applications is a major driving factor of this market. Moreover, the aggressive promotional policies of the Chinese government and investment by private companies has driven the semiconductor industry in China to grow at a quick rate. China’s semiconductor consumption grew at a CAGR of about 19% over the last decade.
The new market research report from Technavio provides a breakdown and analysis of the semiconductor packaging and test segments by technology.
“Of late, the emergence of 3D chip packaging is one of the key trends that this market is witnessing. The rise of 3D chip packaging will provide semiconductor foundries with new business opportunities in the coming years and drive the market growth during the forecast period. 3D packing involves stacking of multiple chips into a single stack, thereby consuming less space,” says Navin Rajendra, Lead Analyst, Hardware & Semiconductor, Technavio Research.
The rapid expansion of semiconductor chip application is one of the major factors contributing to the growth of the semiconductor packaging and test market in China. The use of semiconductor chips has expanded broadly with rising demands from various industries such as power, energy, medical, green cars, networking and telecommunications, LED lighting, automobile, consumer applications, military, aerospace and defense, motor control applications, and robotics.
The key vendors in the semiconductor packaging and test market in China include Amkor Technology, ASE, Powertech Technology, Siliconware Precision Industries (SPIL), STATS ChipPAC, and UTAC. The rising costs of the packaging and test equipment has driven chip manufacturers to sell off the packaging and test facilities and focus more on partnerships and mergers to outsource their packaging and testing of chips.
A more detailed analysis is available in the Technavio report, Semiconductor Packaging and Test Market in China 2015-2019.
We can customize reports by other regions and specific segments upon request.
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