- The key vendors in the global die-level packaging equipment market 2015-2019 are ASM International NV, BE Semiconductor Industries N.V. (Besi), DISCO Corp., and Kulicke & Soffa Industries Inc.
London, 22 July 2015: Technavio, an independent tech-focused global research firm, has announced the publication of its market research report on the global die-level packaging equipment market 2015-2019. The short replacement cycle of portable electronic devices is one of the major trends observed in this market. Recently, it has been noticed that smartphones and tablets become outdated within a short period of time. Frequent launch of next-version models reduces the replacement cycle of portable devices to 8-12 months, and this decline in the lifespan of devices is expected to augment the demand for semiconductor wafers during the next five years. This market is expected to grow at a CAGR of 1.24% during the forecast period of 2014-2019.
The growing demand for smartphones and tablets is a critical factor that drives growth in this market. The market for mobile devices is highly fragmented and contains numerous international and local vendors. The production of low-cost mobile devices by local vendors has resulted in its increasing demand during the forecast period. Consequently, the demand for integrated circuits (ICs), which is an integral part of such devices, will increase during the next five years.
“Initially, aluminum was used for connecting transistors in the semiconductor industry. However, as of late, manufacturers have begun to use copper connecting transistors as copper for high electrical conductivity, which ensures better processing speed and improved performance,” says Faisal Ghaus, Vice President of Technavio Research.
“In the past, copper was not used as a primary material in connecting components such as transistors as it was more difficult to handle compared to aluminum.”
To define the market conditions in the next 3-4 years, Technavio analysts have conducted in-depth analysis of the impact of market drivers, challenges, and trends featuring data on product segmentations, vendor shares, growth rate by revenue, and an evaluation of the different buying criteria in the order of importance.
https://www.technavio.com/%3Cp%3EIf%20you%20are%20interested%20in%20more%…
