3D semiconductor packaging: Key market research findings
- Growing adoption of copper wire bonding drives market growth
- APAC dominates the market geographically
- Key vendors – Amkor Technology, SUSS Microtek, EV Group, and Tokyo Electron
Technavio’s market research analysts predict the global 3D semiconductor packaging market to grow at a CAGR of more than 16% between 2016 and 2020. The increasing adoption of copper wire bonding is the primary driving force behind the growth of this market. The use of copper wires instead of conventional gold wires in chips during 3D semiconductor packaging brings about significant cost-efficiency. As a result, the demand for 3D semiconductor packaging with copper wire bonding in the global market is undergoing an upsurge. During 2015, the APAC region dominated the global market with a 69% of the overall market share. The presence of manufacturing hubs for consumer electronic goods in countries such as China, Taiwan, South Korea, and Japan is expected to contribute to the growth in the 3D semiconductor packaging market in APAC during the forecast period.
The new market research report from Technavio presents a breakdown and analysis of the 3D semiconductor packaging segments based on application.
“Recently, it has been observed that the trend of device miniaturization is gaining traction in the market. Vendors such as Samsung and Apple are manufacturing compact personal electronic devices that consume less power in an attempt to cater to the growing demand for reliable, low-cost, and high-performance devices. The role of 3D packaging is very crucial in miniaturized electronics as 3D integration, essentially through-silicon via (TSV), allows 3D stacking of chips that reduces the size of electronic products and improves their performance with increased functionalities,” says Asif Ghani, Lead Analyst, Semiconductor, Technavio Research.
By 2020, the consumer electronics segment is likely to continue its market dominance by occupying around 94% of the overall market space. The ever-growing penetration of smartphones in the global market is triggering a rise in the demand for ICs. As a result, there is high demand for 3D packaging equipment as ICs require robust packaging technology to ensure small size and high performance. Furthermore, the ongoing trend of miniaturization of devices is also expected to boost sales in the global market.
The key vendors in the market include Amkor Technology, SUSS Microtek, EV Group, and Tokyo Electron. The global 3D semiconductor packaging market has a number of well-established global and regional players. The market is dominated by a few major suppliers and buyers have moderate bargaining power. Global and local vendors are adopting new technologies to gain an edge over their competitors. The potential for growth is pretty high due to the increasing adoption of 3D semiconductor packaging by industries across the globe. There is no adequate substitute for 3D packaging in this market, which lets equipment manufacturers set their prices. Buyers can choose suppliers based on product quality. The market barriers to entry are pretty high, which is restricting the entry of new vendors.
A more detailed analysis is available in the Technavio report, Global 3D Semiconductor Packaging Market 2016-2020.
We can customize reports by other regions and specific segments upon request.
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