PCC-coated wires to dominate the global bonding wire packaging material market through 2020
Bonding wire packaging material: Key market research findings Rising need for miniaturized semiconductor devices Silver bonding wire as upcoming alternative Leading vendors are TANAKA Precious Metals, Heraeus Deutschland, California Fine Wire, and MK Electron Technavio has released a new report on the global bonding wire packaging material market, which is envisaged to generate revenues…