Key vendors to adopt new packaging and assembling technologies
Technavio, a company that develops over 2000 pieces of research every year and covers more than 500 technologies across 80 countries, has announced the top five vendors for the global semiconductor chip packaging market in their latest market research report.
Competitive vendor landscape
The global semiconductor chip packaging market is currently experiencing a shift towards 3D IC technology, leading to increased competition between foundries and OSATs. To capture more market shares, both foundries and OSATs are trying to adopt new packaging and assembling technologies, thereby, creating the demand for advanced equipment. Based on geography, Taiwan led the market in terms of capital spending on semiconductor manufacturing equipment in 2016, followed by South Korea, US, and China.
According to Sunil Kumar Singh, a lead analyst at Technavio for research on semiconductor equipment, “Foundries are using 3D packages to meet the demand from electronic product manufacturers . The emergence of 3D chip packaging will provide semiconductor foundries with new business opportunities in the future; thus, propelling the growth of the semiconductor chip packaging market during the forecast period.”
Click here to request a free sample of this report
Top five vendors in the semiconductor chip packaging market space
Applied Materials
Applied Materials supplies LCD fabrication equipment to the flat panel display industry and solar PV manufacturing systems industry. The company deals in etch systems, epitaxy, ion implant, PVD, and rapid thermal processing. The company operates through four key business segments – Applied Global Services, Silicon Systems Group, Display and Energy, and Environmental Solutions.
Key products: Producer XP Precision, Reflexion LK Prime Chemical Mechanical Planarization (CMP), Producer Avila Plasma-enhanced Chemical Vapor Deposition (PECVD), Centura Silvia Etch, Charger Under-bump Metallization (UBM) Physical Vapor Deposition (PVD), and Endura UBM PVD.
ASM Pacific Technology
ASM Pacific Technology is one of the global leaders in the manufacture of semiconductor assembly and packaging equipment. The company generates its revenue through its SMT solutions, materials, and back-end equipment business segments. ASMPT manufactures and markets assembly and packaging equipment in countries such as China, South Korea, Japan, Taiwan, Philippines, Hong Kong, Malaysia, and the US.
Key products: AB559 series wedge bonders, MCM12 die bonders, AD838FC, AD8312FC, AD9212, AD9312, and UV-cured die bonders.
Kulicke & Soffa Industries
Kulicke & Soffa Industries manufactures capital equipment and tools that are find application in the assembly of semiconductor devices. The company caters primarily to semiconductor device manufacturers, OSATs, industrial manufacturers, and automotive electronics makers. It operates through two business segments – expendable tools and equipment.
Key products: Hybrid Multichip Modules (MCM) and System-in-Package (SiP), Hybrid Package-on-Package (PoP) and Memory, WLP, iX 502, Asterion, and ConnX-LED Plus.
TEL
TEL manufactures semiconductor production equipment, flat-panel display production equipment, PV production equipment, and electronic components and computer networks. The company generates a majority of its revenue through its semiconductor production equipment. The company owns a range of research centers based in Taiwan, New York, and Tokyo.
Key products: Synapse V, Synapse Z, Synapse S, Stratus, and Apollo.
Tokyo Seimitsu
Tokyo Seimitsu manufactures semiconductor manufacturing and processing equipment like wafer probing machines, wafer dicing machines, and wafer inspection equipment, and lithography systems. The company has two key business segments which include semiconductor production equipment (SPE) and metrology.
Key products: AD3000T/S, AD2000T/S, AD20T/S, PG3000RM/PG200RM, UF3000EX, UF3000EX-e, and UF3000LX.
Ask an analyst to know more about this report
A more detailed analysis is available in the Technavio report, Global Semiconductor Chip Packaging Market 2017-2021. Technavio also customizes reports by other regions and specific segments upon request.
Browse related reports
- Global Semiconductor Packaging Equipment Market 2016-2020
- Global Semiconductor Production Equipment Market 2017-2021
- Global 3D Semiconductor Packaging Market 2016-2020
To read more press releases – click here
For any assistance or query, please contact our media team at:
media@technavio.com
US: +1 630 333 9501
UK: +44 208 123 1770
https://www.technavio.com/
