Semiconductor packaging and assembly equipment: Key market research findings
- Increasing complexity of semiconductor IC designs
- Growing demand for semiconductor ICs in car production
Technavio has released a new market research report on the global semiconductor packaging and assembly equipment market, which is expected to grow at a CAGR of around 5% between 2016 and 2020. The increasing global demand for semiconductor ICs is a critical factor that is expected to drive the demand for semiconductor packaging and assembly equipment during the forecast period. APAC accounts for more than 71% of the overall market share, owing to the presence of leading semiconductor foundries in this region, such as Taiwan Semiconductor Manufacturing, United Microelectronics, Samsung, and Semiconductor Manufacturing International.
The new industry research report from Technavio discusses in detail the key drivers and trends responsible for the growth of this market and its sub-segments.
“Of late, there has been increasing demand for semiconductor ICs that can perform multiple functions. Consequently, vendors have developed semiconductor ICs with complex architecture so as to address the rising need for multi-functional ICs. The development of complex semiconductor ICs is a critical factor that impels market growth during the forecast period. Emerging technologies like the IoT, machine-to-machine (M2M), ultra-high-definition (UHD) TVs, hybrid laptops, and vehicle automation are also driving the demand for associated packaging and assembly equipment,” says Asif Ghani Lead Analyst, Hardware & Semiconductor, Technavio Research
The automotive sector is witnessing huge adoption of semiconductor wafers, owing to increased electrification and automation of automobiles. Multiple types of semiconductor ICs are used in automotive products like airbag control, GPS, anti-lock braking systems, car navigation and display, power doors and windows, infotainment, automated driving, and collision detection technology.
The key vendors in the global semiconductor packaging and assembly equipment market include Applied Materials, ASMPT, DISCO, EV Group, Kulicke and Soffa Industries, TEL, and Tokyo Seimitsu. This market is expected to exhibit steady growth over the forecast period and is highly competitive due to the presence of multiple leading foundries and OSATs. The recent shift towards 3D IC technology is envisaged to intensify the level of competition between the foundries and OSATs.
A more detailed analysis is available in the Technavio report, Global Semiconductor Packaging and Assembly Equipment Market 2016-2020.
We can customize reports by other regions and specific segments upon request.
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