According to the latest market research study released by Technavio, the global fan-in WLP market is expected to grow at a CAGR of almost 10% during the forecast period 2016-2020.
This market research report by Technavio provides an in-depth analysis of the market in terms of revenue and emerging market trends. The report also includes an up-to-date analysis and forecasts for various market segments and all geographical regions.
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Technavio research analysts categorize the global fan-in WLP market based on application:
Global fan-in WLP market share by application 2015
|
Analog and mixed IC |
71.61% |
|
MEMS and sensor |
9.11% |
|
Logic and memory IC |
9.11% |
|
Wireless connectivity |
7.03% |
|
CMOS image sensor |
3.13% |
Source: Technavio
The top three revenue contributing application segments are discussed below:
Analog and mixed ICs
The analog and mixed ICs accounted for around 72% of the global fan-in WLP market in 2015 and is expected to grow at a steady rate during the forecast period. In several end-user segments, such as consumer electronics, communications, and automotive, the demand for analog ICs is significantly increasing. The increasing speed of new product development, diminishing cost per function of ICs, and the reduced product replacement cycle have boosted the demand for semiconductor ICs, which is in turn fueling growth in the analog ICs.
“The development of effective analog ICs that deliver enhanced performance and the rapid technological advancements in the semiconductor industry have propelled the expansion of analog ICs in the global market. This will upsurge the demand for fan-in WLP solutions during the forecast period as they guarantee the optimized performance of analog and mixed ICs,” says Sunil Kumar Singh, lead analyst at Technavio for research on semiconductor equipment.
MEMS and sensors
In 2015, MEMS and sensors accounted for around 9% of the global fan-in WLP market. The key revenue generators of the global MEMS market are the consumer electronics and automotive segments. In addition, MEMS and sensors have extensive applications in mobile devices, especially tablets and smartphones. It is expected that the development of new applications will increase the adoption rate of sensors, leading to the effective growth of this segment. MEMS devices cover several nanoelectromechanical components embedded in semiconductor chips and include microcircuits on which small sensors and other components are placed. Various sectors are progressively adopting MEMS devices due to their high efficiency and low cost properties which will boost growth in the market. In addition, a decrease in the average selling price (ASP) of MEMS devices will increase their demand, driving growth in the market. Fan-in WLP is mainly used for fabricating distinct devices and employ wire bond leaded and WLCSP package technologies. Unlike laminate-based CSPs, fan-in WLP solutions have compact package size with high performance and low cost, which will result in their augmented usage throughout the forecast period.
Logic and memory ICs
Logic and memory ICs will grow at a CAGR of around 6% in the global fan-in WLP market, during the forecast period. The requirement for high-powered processors, especially for the automation purposes, has prompted the demand for fan-in WLP solutions in the logic IC segment, as they form an integral part of IC packaging at the manufacturing level. The memory IC segment’s growth is mostly driven by the telecom and communications sectors. The rising production of smartphones and phablets has increased the requirement for memory cards for data storage compatibilities. The memory ICs are used to store and process data and are categorized in two types including volatile memory such as random access memory (RAM) and non-volatile memory such as read-only memory (ROM). Technological improvements have created the demand for advanced electronic devices across sectors, such as performance-packed automobiles, high-powered smartphones, automated machinery in the industrial sector, and electronic devices in the healthcare sector for better monitoring of patients.
Moreover, the advances in computer technology has called for the requirement of flash drives with better competences which are either equipped with NAND technology or NOR technology. The growth in DRAM and NAND flash in mobiles and SSDs drives propels growth in the global memory IC market as the memory ICs are an important part of memory storage devices.
The top leading vendors operating in the global fan-in WLP market are:
- STATS ChipPAC
- STMicroelectronics
- TSMC
- Texas Instruments
Other prominent vendors in the market include Rudolph Technologies, SEMES, SUSS MicroTec, Ultratech, and FlipChip International.
A more detailed analysis is available in the Technavio report titled, ‘Global Fan-in WLP Market 2016-2020’. Technavio also customizes reports by other regions and specific segments upon request.
Other related reports:
- Global Semiconductor Packaging Equipment Market 2016-2020
- Global 3D Semiconductor Packaging Market 2016-2020
- Global System-in-package Market 2016-2020
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