A wide-ranging study of the global 3D IC market with respect to product (MEMS, memories, LEDs, and sensors) and by geography (the Americas, APAC, and EMEA). The report also presents the vendor landscape and a corresponding detailed analysis of the top vendors in the market, including ASE, Samsung Electronics, STMicroelectronics, TSMC, and Toshiba.
Technavio’s market research analysts estimate the global 3D IC market 2015-2019 to generate revenues of $3.5 billion between 2015 and 2019. These 3D ICs are the ultimate solution for meeting the growing demand to minimize the size and reduce the cost of products in the consumer electronics segment. APAC dominates the global market for 3D ICs, accounting for around 52% of the total market revenue. Factors such as the presence of large number of manufacturers in consumer electronics, mobile devices, and automotive products in APAC is generating a huge demand for 3D ICs from this region.
The new market research report from Technavio provides a breakdown and analysis of the 3D IC segments by technology.
“Following the swelling demand for devices with high-functionality, such as high storage capacity, high battery backup, high-definition (HD) display, fast processing speed, and multi-tasking abilities, manufacturers have been driven to integrate 3D ICs within their devices. The market for these devices is growing rapidly among the mobile device and consumer electronics manufacturers due to increasing demand for technology advancements in a smartphone, tablet PCs, smart TVs, and other electronic devices, which are broadly used by consumers,” Navin Rajendra, Industry Manager, Hardware & Semiconductor, Technavio Research.
The memories product segment has been the highest contributor to the total revenue and made up for almost 62% of the overall market. Technological advances and the increase in adoption of 3D NAND and DDR4 DRAM in smartphones, tablet PCs, consumer electronics, and automotive products will drive the growth of the 3D memory chips.
The key vendors in the global 3D IC market include ASE, Samsung Electronics, STMicroelectronics, TSMC, and Toshiba. At present, this market mark the presence of very few vendors. However, since the market has great potential for growth, especially in memory products, many new players are trying to qualify for TSVs technology to capture the market. Also, more collaboration between OSAT, IDMs, and OEMs is expected to bring down the cost of 3D ICs in the future.
A more detailed analysis is available in the Technavio report, Global 3D IC Market 2015-2019.
We can customize reports by other regions and specific segments upon request.
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