TechNavio recognizes the following companies as the key players in Global Wafer Level Packaging Inspection Systems Market: Camtek Ltd., KLA-Tencor Corp., Rudolph Technologies Inc., and Topcon Technohouse Corp.
Commenting on the report, an analyst from TechNavio’s team said: “The short replacement cycle of portable electronic devices is a major trend witnessed in the Global Wafer-level Packaging Inspection Systems market. In the current scenario, portable electronic devices such as smartphones and tablets are becoming obsolete within a short period of time. The main reason for this is the quick succession of next-version models, which results in consumers replacing older versions of their devices with newer ones. At the present time, the duration of the replacement cycle period is 8-12 months, but it used to be much longer. Therefore, this reduction in the product replacement cycle is fostering the demand for semiconductor wafers for their use in newly launched devices.”
According to the report, the growth of the Global Wafer-level Packaging Inspection Systems market is driven by several factors, the most important of which is the rising demand for smartphones and tablets. One of the major reasons for the growing demand for these devices is their increasing adoption in emerging markets. This subsequently creates more demand for semiconductor wafers, thus driving the growth of the Global Wafer-level Packaging Inspection Systems market.
Further, the report states that one of the key challenges in the market is the cyclical nature of the Semiconductor industry. As a result of this, many wafer-level packaging inspection system manufacturers often experience fluctuating revenues, which in turn adversely affects their profitability.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors. For further information on this report, please visit https://www.technavio.com/report/global-wafer-level-packaging-inspection-…
TechNavio, the market research platform of Infiniti Research Ltd., publishes periodic market research reports on niche and emerging technologies. For more information on our market research, please visit https://www.technavio.com/it-hardware-software-services
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TechNavio Announces the Publication of its Research Report – Global Wafer Level Packaging Inspection Systems Market 2014-2018
