TechNavio recognizes the following companies as the key players in the Global 3D Semiconductor Packaging Market: Advanced Semiconductor Engineering Inc., Amkor Technology Inc., Siliconware Precision Industries Co. Ltd. and Powertech Technology Inc.
Commenting on the report, an analyst from TechNavio’s Hardware team said: ”The semiconductor packaging companies are expected to have large packaging capacities as a primary criterion to receive orders from the semiconductor chip manufacturers. The semiconductor chip manufacturers tend to prefer to outsource their packaging to one capable and reliable vendor rather than to a number of vendors. As a result, the players in this market are increasing their capacity in terms of machinery as well as staffing levels to cope with the demand from their customers”
According to the report, the Global 3D Semiconductor Packaging market has several factors driving the market. The key growth factor is the need to reduce the rising costs involved in designing a compact device with significant power efficiency. In order to design and manufacture such a device, the players in the Global Semiconductor market are focusing more on 3D semiconductor packaging.
Further, the key challenge hindering growth is the cyclical nature of the Global Semiconductor market, which is leading to fluctuating demand and revenue for these vendors.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors. For further information on this report, please visit https://www.technavio.com/content/global-3d-semiconductor-packaging-marke…
TechNavio, the market research platform of Infiniti Research Ltd., publishes periodic market research reports on niche and emerging technologies. For more information on our Hardware market research, please visit https://www.technavio.com/hardware
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TechNavio Announces the Publication of its Research Report “ Global 3D Semiconductor Packaging Market 2012-2016
