TechNavio today launched its report, Global 3D IC Market 2012-2016, based on an in-depth analysis exclusively covering the Americas, and the EMEA and APAC regions. The report aims to aid decision makers’ understanding of the significant trends impacting the market.
Commenting on the report, an analyst from TechNavio’s Hardware team said: ”One of the emerging trends in the Global 3D integrated circuit (IC) market is multi-chip packaging. In this type of packaging more transistors can be packed into a single 3D IC. This type of packaging is very important for memory-enhanced applications because this approach enables improved interaction between the memory and the processor. It is expected that multi-chip packaging will be a promising approach for most applications in the future. Thus, vendors consider that multi-chip packaging is one of the crucial trends that will lead to the growth of the Global 3D IC market.”
According to the report, one of the major growth drivers is the increasing demand for 3D ICs in memory products (flash memory and DRAM). 3D ICs are able to improve the performance and reliability of memory products and can also help reduce their cost and size.
Further, the report reveals that one of the major challenges is the thermal conductivity issues associated with 3D ICs.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors. For further information on this report, please visit https://www.technavio.com/content/global-3d-ic-market-2012-2016
TechNavio, the market research platform of Infiniti Research Ltd, publishes periodic market research reports on niche and emerging technologies. For more information on our Hardware market research, please visit https://www.technavio.com/hardware
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TechNavio Announces the Publication of its Research Report – Global 3D IC Market 2012-2016
