London, 09 October 2014 – TechNavio, a global tech-focused research firm has announced the publication of its market research report on the Global 3D IC Market 2014-2018.
3D ICs are the perfect solution for meeting the growing demand of minimizing the size and reducing the cost of consumer electronics products. In these ICs, the transistor density is kept higher so as to offer better performance. The Global 3D IC Market is expected to grow at a CAGR of 18.4 percent during the forecast period.
About the Report
The latest report by TechNavio focuses on an increase in demand for 3D ICs in memory products, as they improve the performance and reliability of memory products, reduce cost and size and enable high memory capacity. The report also highlights the emerging trend of multi-chip packaging that allows more transistors to be packed into a single 3D IC.
“This packaging is important for memory-enhanced applications because it enables improved interaction between the memory and the processor. Multi-chip packaging is expected to be a promising approach for most applications in the future of this market,” says Faisal Ghaus, Vice President of TechNavio.
Key Information Covered in the Report:
Market segmentation, size and forecast through 2018
Market Growth Drivers:
- Increased Demand for Memory-enhanced Applications.
- For a full detailed list, view our report.
Market Challenges:
- Thermal Conductivity Issues.
- For a full detailed list, view our report.
Market Trends:
- Multi-chip Packaging.
- For a full detailed list, view our report.
Key Vendors:
- Advanced Semiconductor Engineering (ASE)
- Samsung Electronics
- STMicroelectronics
Other Prominent Vendors:
- 3M Company
- IBM
- Micron Technology
- STATS ChipPAC
https://www.technavio.com/%3Cp%3E%3Ca%20href%3D%22http%3A//www.technavio….
