London, 19 November 2014: TechNavio, the independent tech-focused global research firm, has published a report on the Global In-line AOI SPI Market 2014-2018, which is expected to grow at a CAGR of 7.24 percent during the period 2013-2018.
Currently in the market, there is an emergence of miniaturized components, along with denser board packages. Denser and complex assemblies, including BGAs, flip chips, and CSP, are compelling automated inspection processes to ensure quality. This is expected to be the prime reason for the demand for SMT inspection equipment. The increased demand for AOI equipment is because of its easily programmable and flexible algorithms that detect defects in an efficient and effective manner. Better accuracy, reliability, enhanced quality, and traceable defects are a few factors that will continue to remain as significant drivers for the AOI Equipment market.
“AOI/SPI equipment manufacturers are focusing on providing systems with a high level of capacity and accuracy that can efficiently handle shorter product lifecycles and the increased number of product versions,” says Faisal Ghaus, Vice President of TechNavio.
Key Market Drivers
- Increased Adoption in Electronics Industry
- New Product Development
- Declining Cost per Function of ICs
- Increased Adoption of 3D AOI/SPI Technologies
Key Market Trends
- Miniaturization of Devices
- Increased R&D Spending
- Increase in Production Capacity
- Short Replacement Cycle of Electronic Devices
Key Market Vendors
- CKD Corp.
- CyberOptics Corp.
- Koh Young Technology Inc.
- Mirtec Co. Ltd.
- Test Research Inc.
To define the market circumstances in the next 3-4 years, TechNavio analysts have conducted in-depth analysis of the impact of market drivers, challenges and trends featuring data on product segmentations, vendor shares, growth rate by revenue and an evaluation of the different buying criteria in the order of importance.
https://www.technavio.com/%3Cp%3EIf%20you%20are%20interested%20in%20more%…
