London, 27 October 2014 –The Global Mixed Signal SoC Market is growing at a CAGR of 12.75 percent from 2014-2018, says research firm TechNavio.
About the Report
The latest report by TechNavio focuses on the increase in chip density as a main growth driver for SoC technology. The number of functions that an IC is able to perform has increased considerably, while the cost of the IC has decreased gradually because of high circuit densities.
“To keep pace with increasing levels of integration, designers and engineers are continuously developing new methodologies and techniques to manage more circuitry within the same area at the same cost. This has resulted in the emergence of a new methodology called SoC design, wherein predesigned and pre-verified blocks such as IP blocks, IP cores, and virtual components are combined on a single chip,” says Faisal Ghaus, Vice President of TechNavio.
“Currently, more than 85 percent of SoCs are mixed signals, which contain both digital and analog circuits. This has provided SoC manufacturers with a platform to reduce the size of the IC, and also integrate a large number of functions on a single IC, which can handle many application-specific processing functions.”
Key Information Covered in the Report:
Market segmentation, size and forecast through 2018
Market Growth Drivers:
- Increase in Chip Density
- For a full detailed list, view our report.
Market Challenges:
- Complexity in Design Process
- For a full detailed list, view our report.
Market Trends:
- Convergence of Many Applications onto a Single Platform
- For a full detailed list, view our report.
Key Vendors:
- Broadcom Corp.
- Freescale Semiconductor Ltd.
- Infineon Technologies AG
- Intel Corp.
- Qualcomm Inc.
- Texas Instruments Inc.
Other Prominent Vendors:
- Altera
- ARM Holdings
- Marvell Technology Group
- STMicroelectronics
https://www.technavio.com/%3Cp%3E%3Ca%20href%3D%22http%3A//www.technavio….
