This market research report presents a detailed segmentation of the global semiconductor packaging materials market by type of materials (organic substrates, bonding wires, lead frames, encapsulation resins, ceramic packages, die attach materials, solder balls, and others) and by geography (APAC, Europe, and North America). The leading vendors in this market are Amkor Technology, DuPont, Henkel, Hitachi Chemical, Honeywell, Kyocera, and Toppan Printing.
Technavio’s market research analysts estimate the global semiconductor packaging materials market to grow at a CAGR of around 5% between 2016 and 2020. Semiconductor package components vary in dimensions and functionality and primarily are organic substrates, leadframes, bonding wires, encapsulation resins, die attach materials, solder balls, and thermal interface materials. The packaging materials are made to be very application specific and cannot be used for substitute purposes. APAC leads the global market for semiconductor packaging materials, occupying around 93% of the total market share. The market will experience robust growth due to increased demand for smart mobile devices and other electronic goods during the forecast period.
The new market research report from Technavio provides a breakdown and analysis of the semiconductor packaging materials segments by technology.
“One of the key trends gaining traction in this market is the popularity of redistributed chip packaging, as it offers a low cost high performance alternative to all kinds of BGA (ball grid array) packaging. It ensures dimensional shrink in the package size by about 30%, eliminating bonding wires, flip chips, and other components in the process. This technology can be used for demanding applications where advanced electrical and thermal performance is desired such as high-frequency RF (radio-frequency) modules, sensors, and MEMS (micro-electro-mechanical systems),” says Sharan Raj, Lead Analyst, Transportation & Logistics, Technavio Research
The organic substrates segment is the largest in the semiconductor packaging materials market and is expected to generate revenues of over USD 14 billion by the end of the forecast period. As these materials form the base layers of individual semiconductor devices and chips on which other layers are deposited to complete the circuit, they are increasingly preferred over other materials like lead frames as the industry is decreasing the use of lead.
The key vendors in the global semiconductor packaging materials market are Amkor Technology, DuPont, Henkel, Hitachi Chemical, Honeywell, Kyocera, and Toppan Printing. This market is highly fragmented with a number of multinational, regional, and local providers. This market is dominated by manufacturers in the APAC region. Local players are raising the stakes by offering innovative solutions at lower prices than international vendors through re-engineering and other methods. Small and local vendors compete on the basis of cost with international vendors. Growth in this market will be inorganic, mostly by M&As of small vendors by international companies.
A more detailed analysis is available in the Technavio report, Global Semiconductor Packaging Materials Market 2016-2020.
We can customize reports by other regions and specific segments upon request.
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