This market research report presents segmentation of the organic substrate packaging material market based on packaging technology (SO, GA, Flat no-leads, QFP, DIP, and others), and by geography (Europe, North America, APAC, and ROW). It also presents the vendor landscape and a detailed analysis of the top vendors in the global organic substrate packaging material market, including, Mitsubishi, AMKOR, and SPIL.
Technavio market research analysts estimate the organic substrate packaging material market to grow at a CAGR of around 5% between 2015 and 2019. Advancements in packaging technologies with continuous developments in semiconductors, and system miniaturization is primarily driving this market’s growth.
APAC dominates the organic substrate packaging material market with a share of around 67%. Taiwan, Japan, China, and South Korea are the leading countries in the APAC market due to high technical strength and strong industrial chain cooperation. Taiwan is expected to grow at a faster rate than other markets in the region, due to its robust foothold in advanced packaging and foundry operations.
Organic substrate packaging material market in Taiwan 2014-2019
Source: Technavio Research
Rising demand for ultra-thin mobile phones has escalated the requirement for flip chip-chip scale package (FC-CSP) solutions as it has good heat dissipation features. Flip chip technology is the mechanism of electrically connecting the die to the substrate or leadframe. This technology allows the die to have a better contact with the heat sink. It minimizes the output signal inductance by reducing the length of interconnects. It also decreases the package footprint size. FC-CSP will replace PoP in smartphones and tablets by the end of the forecast period.
“Increasing trend towards smaller, lightweight, and cost-effective electronic devices globally has driven innovations within the organic substrate packaging materials industry. Technologies such as SiP, PoP, and WLP are pushing the development of new solutions. For instance, a conductive bump soldered on top of the chip in flip-chip packaging ensures high system density and improved performance in a miniaturized package,” says Sriram Mohan, Lead Analyst, Chemicals & Materials, Technavio Research.
Major vendors in the global organic substrate packaging material market are ASE Kaohsiung, AMKOR, SPIL, STATS ChipPAC, Mitsubishi and AJINOMOTO. The market is highly fragmented due to the presence of multinational, regional, and local vendors in the market. Local vendors are providing innovative and low-cost solutions through re-engineering processes, hence, intensifying competition in the market.
A more detailed analysis is available in the Technavio report, Global Organic Substrate Packaging Material Market 2015-2019.
https://www.technavio.com/%3Cp%3E%3Cem%3E%3Cu%3E%3Cstrong%3EWe%20can%20cu…
