London, 11 June 2015: Technavio, the independent tech-focused global research firm, has published a report on the flexible packaging adhesives technology market in China 2015-2019, which is expected to grow at a significant CAGR of 12.37% by volume and 10.09% by revenue during the forecast period of 2014-2019.
The increase in production capacities by manufacturers of adhesives and the efforts of the government and trade unions in China to ensure the production of environmentally friendly and high-quality products are fueling the market growth.
The increasing competitiveness in the flexible packaging adhesives market in China, owing to the entry of major global adhesive manufacturers, such as HB Fuller, in the country in recent years, has forced the existing market players to focus on developing and providing advanced adhesives to maintain their market share,” says Faisal Ghaus, Vice President of Technavio.
Key Market Drivers
- Growing Flexible Packaging Market in China
- Increase in Production Capacities and Investment in R&D
- Increased Demand for Eco-friendly Products
- Continued Economic Growth in China
Key Market Trends
- Growing Popularity of Bio-based Flexible Packaging Adhesives
- Development of Advanced Innovative Adhesives
- Increased Demand for Acrylic Adhesives
- Rising Popularity of Retort Packaging
- Introduction of Advanced Lamination Machinery
Key Market Vendors
- Beijing Comens New Materials Co. Ltd.
- Coim Group
- Cromogenia-Units SA
- Dow Chemical Co.
- Henkel AG
- Huzhou Ochem Chemical Co. Ltd.
- Mitsui & Co. Ltd.
- Sapici SpA
- Shanghai KangDa New Materials Co. Ltd.
- Toyo Ink Group
To define the market circumstances in the next 3-4 years, Technavio analysts have conducted in-depth analysis of the impact of market drivers, challenges and trends featuring data on product segmentations, vendor shares, growth rate by revenue and an evaluation of the different buying criteria in the order of importance.
https://www.technavio.com/%3Cp%3EIf%20you%20are%20interested%20in%20more%…
