London, 31 October 2014 – The Global Thermal Interface Materials Market is expected to grow at a CAGR of 10.30 percent from 2014-2018, says research firm TechNavio.
Thermal interface materials are used extensively in mobile handsets and entertainment devices in the telecom and electronics sectors. As these devices are called on to perform more and more functions, the use of TIM and thermal management techniques have become a necessity.
About the Report
The new report from TechNavio highlights the increased usage of phase-change thermal interface materials (PCTIMs), which are better suited for use in areas where process convenience is more important than the thermal conduction properties of the material. As PCTIMs provide close interfacial contact and form very thin bond lines, they are highly preferred for commercial use in various thermal management applications over polymer-based TIM.
“PCTIMs’ are being increasingly used in assembly-line electronic components manufacturing processes for their ease of application, which is expected to have a significant effect on the market,” says Faisal Ghaus, Vice President of TechNavio.
“Vendors like Henkel Corp., Laird, and 3M have been competing to gain a technological advantage over each other so as to increase their market share, which has also led to significant technological developments in last few years.”
Key Information Covered in the Report:
Market segmentation, size and forecast through 2018
Market Growth Drivers:
- Increased Functionality of Telecom and Electronic Devices
- For a full detailed list, view our report.
Market Challenges:
- Concentration of Demand
- For a full detailed list, view our report.
Market Trends:
- Increased Usage of PCTIM
- For a full detailed list, view our report.
Key Vendors:
- Henkel Corp.
- Laird Plc
Other Prominent Vendors:
- 3M
- AI Technology
https://www.technavio.com/%3Cp%3E%3Ca%20href%3D%22http%3A//www.technavio….
