London, 21 October 2014: TechNavio, the independent tech-focused global research firm, has published a report on the Global Pressure-sensitive Adhesives Market 2014-2018, which is expected to witness a CAGR of 5.32 percent during the period 2014-2018.
“Rapid industrialization and economic development has led to the growth of industries such as Automotive, Electrical and Electronics, and Packaging, thereby driving the consumption of pressure-sensitive adhesives,” says Faisal Ghaus, Vice President of TechNavio.
“A rapidly growing manufacturing industry and an increasing number of infrastructure development projects in India are expected to be key growth drivers for the Pressure-sensitive Adhesive market in the APAC region.”
Key Market Drivers
- Increased Demand for Specific Applications
- Strong Demand for Water-based Pressure-sensitive Adhesives
- High Demand from Automotive Industry
Key Market Trends
- Increased Demand from APAC Region
- Growing Demand for Bio-based Pressure-sensitive Adhesives
- Growing Consumption of Pressure-sensitive Adhesives for Labels and Tapes
Key Market Vendors
- 3M Co.
- Avery Dennison Corp.
- Bostik SA
- H.B. Fuller
- Sika AG
To define the market circumstances in the next 3-4 years, TechNavio analysts have conducted in-depth analysis of the impact of market drivers, challenges and trends featuring data on product segmentations, vendor shares, growth rate by revenue and an evaluation of the different buying criteria in the order of importance.
https://www.technavio.com/%3Cp%3EIf%20you%20are%20interested%20in%20more%…
