Chip mounter: Key market research findings Miniaturization of electronics Increasing automation in automobiles Leading market vendors include Hitachi, Samsung, Panasonic, and Juki Technavio has released a new report on the global chip mounter market, which is anticipated to grow at a CAGR of around 8% between 2016 and 2020. The increasing demand for miniaturized…
Mask inspection equipment: Key market research findings Demand for SoC technology drives market growth APAC dominates the market geographically Key vendors – include KLA-Tencor, Applied Materials, and Lasertech Technavio’s market research analysts predict the global mask inspection equipment market to grow at a CAGR of more than 10% between 2016 and 2020. The recent…
Semiconductor capital equipment: Key market research findings APAC to dominate the market geographically Foundry segment to continue market dominance Key vendors – ASML, Applied Materials, Lam Research, and Tokyo Electron Technavio’s market research analysts predict the global semiconductor capital equipment market to grow at a CAGR of over 4% between 2016 and 2020. The…
Semiconductor chip handlers: Key market research findings Increase in wafer sizes drives market growth APAC dominates the market geographically Key vendors – Seiko Epson Corporation, Multitest, ASM Pacific Technology, Cohu, Advantest, and Boston Semi Equipment Technavio’s market research analysts predict the global semiconductor chip handlers market to grow at a CAGR of over 4%…
Signal generator: Key market research findings Increased demand from aerospace and defense industry Emergence of high-speed DAC Key vendors are Keysight Technologies, National Instruments, Agilent Technologies, Anitsu, B&K Precision, Keithley Instruments, Rohde&Schwarz, and Tektronix Technavio has released a new report on the global signal generator market, which is expected to grow at a CAGR…
Bonding wire packaging material: Key market research findings Rising need for miniaturized semiconductor devices Silver bonding wire as upcoming alternative Leading vendors are TANAKA Precious Metals, Heraeus Deutschland, California Fine Wire, and MK Electron Technavio has released a new report on the global bonding wire packaging material market, which is envisaged to generate revenues…
Semiconductors in Vietnam: Key market research findings Availability of low-cost labor to drive market growth Power management ICs to dominate the market Key vendors – Intel, Hitachi, ON Semiconductor, Saigon Semiconductor Technology, NXP Semiconductors, and STMicroelectronics Technavio’s market research analysts predict the semiconductor market in Vietnam to grow at a CAGR of around 15%…
MLCC: Key market research findings Product innovation drives the market APAC dominates the market geographically Key vendors—Murata, Samsung Electro-Mechanics, TDK, and TAIYO YUDEN. The market research analysts at Technavio predict the global MLCC market to grow at a CAGR of almost 3% between 2016 and 2020. The increase in product advancements is the key…
HSI: Key market research findings Rise in deployment of HSI in various applications drives market growth The defense segment is the dominant shareholder in the market Key vendors—Headwall Photonics, IMEC, NEO, SPECIM, and Telops The market research analysts at Technavio predict the global HSI market to grow at a CAGR of almost 12% between…
DDIC for TVs: Key market research findings Increasing preference for better image resolution HDTV segment to decline in terms of market share Key vendors—Novatek Microelectronic and Himax Technologies Technavio’s market research analysts estimate the DDIC market for TVs to grow at a CAGR of almost 36% in terms of shipment between 2016 and 2020….
