The global EDA for PCB and MCM market was valued at $12 billion in 2015 and is expected to surpass $15 billion by 2020, says Technavio.
Technavio’s semiconductor equipment portfolio has announced its latest market research report on EDA for PCB and MCM for the forecast period, 2016-2020. This market analysis discusses the major drivers and key emerging trends that will influence the growth of the global EDA for PCB and MCM market during the forecast period. Some of the top vendors listed in this industry analysis include Cadence Design Systems, Mentor Graphics, and Synopsys.
In terms of geographical analysis, the Americas will account for the largest share of the global market and is expected to reach a revenue of almost $334 million by 2020. The US will emerge as the key revenue-generator in the region.
“The global market is currently witnessing an upsurge in the demand for semiconductor memory devices. The high growth potential of semiconductor memory devices compared to other semiconductor devices is prompting manufacturers to shift their focus to 3D NAND and DRAM from logic and analog and to memory devices from discrete devices. For instance, smartphone and notebook OEMs are moving from HDD to flash memory for data storage,” says Sunil Kumar Singh, a lead analyst at Technavio for research on semiconductor equipment.
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The new industry research report from Technavio analyzes some of the key drivers and trends responsible for the growth of this market and its sub-segments.
Increasing complexity in semiconductor device designs
Electronics manufacturers are attempting to create prdouct differentiations by adding more functionalities and features in their devices. This trend is fueling the need for multifunctional ICs in the market. Furthermore, the increased demand for miniaturized electronic devices is resulting in the high level of integration on a single chip. Semiconductor device manufacturers are addressing such needs by developing products with new and more complex architecture and designs. Semiconductor devices such as 3D ICs and 3D NAND are compact, consume less power, and are more efficient than 2D semiconductor devices.
Surging demand for SoC technology
The high processing ability of SoC makes it possible to follow the demand for multicore technologies and embedded graphics. Several smart electronics manufacturers have started integrating this technology into their products such as ECG, wireless communication equipment, telemetry devices, smartphones, and automotive body electronics. Furthermore, the emergence of system-in-package (SiP) technology has compelled mixed-signal SoC companies to add more functionality to a single chip at a low price. This development coupled with the penetration of the Internet has resulted in more complex semiconductor devices and increased the penetration of SoCs in many varied application areas.
Miniaturization of electronic devices
Semiconductor IC manufacturers are investing in R&D to optimize the performance and reduce the size of ICs, fueled primarily by the demand for miniaturization from sectors such as communication, automotive, industrial manufacturing, and healthcare equipment. This has resulted in the emergence of 3D semiconductor devices and microelectromechanical systems (MEMS). MEMS and 3D ICs are integrated with more number of interconnects and transistors in the same space, which requires finer deposition and patterning. Furthermore, the integration of an increasing number of transistors per IC has resulted in physical access limitations and increased circuit design complexity. The use of EDA for PCB and MCM software tools assist engineers and designers to develop better end products.
Some of the other prominent vendors identified in this report are Altium Limited, ANSYS, Fujitsu, Infinite Graphics Incorporated, NEC Corporation, Orbotech, and Zuken.
This research report includes an in-depth analysis, market shares, and sizes of the sub-segments and geography. It provides a comprehensive analysis of the key companies, including their market shares, business overview, and key financials. The market study also offers a detailed analysis of key drivers, challenges, and opportunities influencing this market.
A more detailed analysis is available in the Technavio report titled, ‘Global EDA for PCB and MCM Market 2016-2020’. Technavio also customizes reports by other regions and specific segments upon request.
Other related reports:
- Global Electronic Design Automation Market 2016-2020
- Global Cloud EDA Market 2016-2020
- Global Printed Circuit Board Market 2016-2020
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