Technavio, a tech-focused market research firm, has published a new report on the global anti-static packaging market, which is expected to experience a slow but steady market growth rate of more than 8% during the forecast period 2016-2020.
This latest report by Technavio covers the market outlook and growth prospects of the global anti-static packaging market for 2016-2020, considering 2015 as the base year. In addition, an overview of the market, key leading countries, vendor landscape, and a detailed analysis of the top vendors operating in this market are covered in the report.
Based on geographical division, Technavio market researchers segment the global anti-static packaging market into the following key regions: APAC, the Americas, and EMEA.
Geographical segmentation of the global anti-static packaging market for 2015 (market share %)
|
APAC |
47.8% |
|
Americas |
28.5% |
|
EMEA |
23.7% |
Source: Technavio
APAC: largest revenue generating region for anti-static packaging
During 2015, the global market for anti-static packaging was led by APAC with a market share of around 48%. The anti-static packaging market in APAC is expected to showcase substantial growth during the forecast period owing to the flourishing electronics market in the region. Anti-static packaging is used for the packaging of electronic goods and hence, are in high demand in the electronics market. The availability of cheap labor, raw materials, and favorable factors of production have made APAC a major producer of electronic goods.
According to Sharan Raj, a lead analyst at Technavio, specializing in research on packaging, “The increasing adoption of smart mobile devices and consumer electronic goods in the region is spurring an upsurge in the demand for anti-static packaging in APAC. Taiwan, South Korea, Japan, and China are also major producers of packaging resins and wafer fabrication materials in this region. During 2015, these countries accounted for 67% of the global production capacity of integrated circuit wafers that require anti-static packaging.”
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Anti-static packaging market in Americas
The market for anti-static packaging in the Americas is expected to showcase steady growth during the forecast period with a CAGR of around 8%. The demand for anti-static packaging in the Americas is tandem with the growth of the communication network infrastructure and automotive markets in the region. Developing countries in the region such as Mexico and Brazil are anticipated to attract investments in communication network infrastructure during the forecast period, thus, increasing the demand for anti-static packaging. Developed countries in the region such as the US will experience an increase in the demand for anti-static packaging from various industries such as automobile and IoT. The presence of major semiconductor players in the US such as Intel Corporation, Qualcomm, and Texas Instruments, who account for a share of more than 20% of the global semiconductor market, will also contribute to the growth of the anti-static packaging market in the region.
Anti-static packaging market in EMEA
The market for anti-static packaging in EMEA accounted for almost 24% of the overall market share during 2015. The growth of the market in this region will be the slowest when compared to other geographical segments due to the slowing electronics industry in Europe. Germany is the key revenue generating region in the European market owing to of the presence of automotive and electronics manufacturing industries, which account for more than 50% of the demand for semiconductor ICs that require anti-static packaging. Western Europe is also registering a large scale demand for anti-static packaging because of the presence of various firms involved in the packaging of different materials. The use of anti-static packaging for digital signage is also expected to play a key role in driving the market in EMEA. The growing demand for communication network infrastructure in developing countries such as South Africa acts as a key driver for the growth of the anti-static packaging market in EMEA during the forecast period.
The top leading vendors operating in the global anti-static packaging market are:
- 3M
- BASF
- Dow Chemical
Other prominent vendors in the market include DaklaPack, Desco Industries, Dou Yee, GWP, Kao-Chia Plastics, Miller Supply, Polyplus Packaging, TIP Corporation, and Uline.
A more detailed analysis is available in the Technavio report titled, ‘Global Anti-Static Packaging Market 2016-2020’. Technavio also customizes reports by other regions and specific segments upon request.
Other related reports:
- Global Honeycomb Paperboard Packaging Market 2016-2020
- Global Semiconductor Packaging Equipment Market 2016-2020
- Global On-the-go Packaging Market 2016-2020
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