London, 13 January 2015: TechNavio, the independent tech-focused global research firm, has published a report on the Global Wafer-level Packaging Equipment Market 2015-2019, which is expected to witness slow growth at a CAGR of 0.1 percent during the forecast period of 2014-2019.
Recent advances in technology, along with improved durability, reduced energy consumption, superior performance, enhanced quality, and the highly efficient features of semiconductor wafer-level packaging equipment are making them an attractive solution in the Semiconductor industry.
“As the market is witnessing an emergence of miniaturized electronic products, semiconductor foundries are focusing on factors such as integrating different features, reducing the size of semiconductor wafers, and lowering IC power consumption,” says Faisal Ghaus, Vice President of TechNavio.
Key Market Drivers
- Increased Demand for Smartphones and Tablets
- Steady Growth of Semiconductor Wafer Industry
- Decline in Cost per Function of ICs
- Emergence of 3D Chip Packaging
- Increase in New Product Development
Key Market Trends
- Short Replacement Cycle of Portable Electronic Devices
- Emergence of Product Miniaturization
- Increased M&A
- Fabless Semiconductor Companies
- Shift from Aluminum to Copper Interconnections
- Increased R&D Spending
Key Market Vendors
- Applied Materials Inc.
- Disco Corp.
- EV Group
- Tokyo Electron Ltd.
- Tokyo Seimitsu Co. Ltd.
To define the market circumstances in the next 3-4 years, TechNavio analysts have conducted in-depth analysis of the impact of market drivers, challenges and trends featuring data on product segmentations, vendor shares, growth rate by revenue and an evaluation of the different buying criteria in the order of importance.
https://www.technavio.com/%3Cp%3EIf%20you%20are%20interested%20in%20more%…
