London, 18 February 2015: TechNavio, the independent tech-focused global research firm, has published a report on the Blister Packaging Market in the US 2015-2019, which is expected to grow at a CAGR of 6.11 percent during the period 2014-2019.
“Vendors use improved raw materials in blister packs to provide maximum protection for products, especially medicines and medical equipment,” says Faisal Ghaus, Vice President of TechNavio.
“Thermoformed blister packaging of medical products provides flexibility, chemical resistance, transparency, and durability to enhance safety and efficiency in laboratory, hospital, and household use.”
Key Market Drivers
- Growing Demand from Pharmaceutical Industry
- Increased Demand for Interactive and User-friendly Packs
- Demand for High-barrier Films
Key Market Trends
- Enhanced Protection Criteria
- Technological Innovation
- Growing Awareness of Sustainable Development
Key Market Vendors
- Amcor Ltd.
- Bemis Co. Inc.
- MeadWestvaco Corp.
- Sonoco Products Co.
To define the market circumstances in the next 3-4 years, TechNavio analysts have conducted in-depth analysis of the impact of market drivers, challenges and trends featuring data on product segmentations, vendor shares, growth rate by revenue and an evaluation of the different buying criteria in the order of importance.
https://www.technavio.com/%3Cp%3EIf%20you%20are%20interested%20in%20more%…
