- The key vendors in the Global Semiconductor Packaging Materials Market 2015-2019 are Alent plc., BASF SE, Henkel AG and Company, Hitachi Chemical Co. Ltd. and Kyocera Corp.
London, 17 February 2015: TechNavio, an independent tech-focused global research firm, has announced the publication of its market research report on the Global Semiconductor Packaging Materials Market 2015-2019. One of the key trends emerging in this market is the popularity of redistributed chip packaging. It is used across varied package configurations, such as single die, multi-die, and SiPs. This technology can also be used for demanding applications where advanced electrical and thermal performance is desired. These include high-frequency RF modules, sensors, and MEMS. The Global Semiconductor Packaging Materials market is expected to witness a CAGR of 4.33 percent during the forecast period of 2014-2019.
Major customers of semiconductor packaging materials are scattered across various verticals such as the Consumer Electronics, Telecom, and Automotive sectors. These customers benefit from these products as they not only protect the semiconductor die and IC fabrication from external disturbances, such as physical pressure, contaminants, heat, and moisture, but act as an interconnect between the I/O pins of the chips and the external circuit board.
“Lead-free packaging is gaining popularity and is set to continue to do so during the forecast period to adhere to international standards of compliance,” says Faisal Ghaus, Vice President of TechNavio Research.
“Companies have started adopting lead-free packaging such as leads, solder balls, bumps, and PCB soldering.”
To define the market conditions in the next 3-4 years, TechNavio analysts have conducted in-depth analysis of the impact of market drivers, challenges and trends featuring data on product segmentations, vendor shares, growth rate by revenue and an evaluation of the different buying criteria in the order of importance.
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