Technavio Says High Density DRAM Will Cater To the Growing Demand from OEMs, Thus Propelling the Global DRAM Market Through 2019

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London, 03 July 2015 – Technavio has published a new report on the global DRAM market, which is expected to grow at a CAGR of more than 13% from 2015-2019.

About the Report

According to the latest market research report by Technavio, manufacturers are trying to roll out new products with better performance and more functionalities, in order to capture a greater market share and to attract the tech-savvy generation. Products like iPhone and Samsung S6 are expected to come with 2 Gb and 3 Gb LPDDR4, respectively.

“Density is the top buying criterion for the computing DRAM segment. To cater to the demand from the server segment, vendors are investing in R&D to introduce new higher-density DRAM,” says Faisal Ghaus, Vice President of Technavio.

The latest report by Technavio also emphasizes an increase in consolidation, which is expected to continue during the forecast period.

“The existing vendors and new entrants are taking the acquisitive route to either enter the market or broaden their portfolio of offerings,” says Ghaus. 

Market Scope and Calculation of Market Size

The new Technavio report covers the present scenario and the growth prospects of the global DRAM market from 2015-2019. To calculate the market size, the report considers revenue generated from sales as well as shipments of DRAM worldwide.

Key Information Covered in the Report:

Key Vendors:

  • Micron Technology Inc.
  • Nanya Technology Co.
  • Samsung Electronics Co. Ltd.
  • SK Hynix Inc.
  • Winbond Electronics Corp.

Market Growth Drivers:

  • Increase in Penetration of Smartphones in Developing Countries
  • For a full detailed list, view our report.

Market Challenges:

Market Trends:

  • Increase in Mergers and Acquisitions
  • For a full detailed list, view our report.

https://www.technavio.com/%3Cp%3E%3Cstrong%3E%3Ca%20href%3D%22http%3A//ww…