Implementation of Rack-level Cooling Fostering Growth in the Data Center Rack Market in the US: Technavio Report

Renewable energy

 

  • The key vendors in the data center rack market in the US 2015-2019 are Black Box Network Service, Eaton Corp., Emerson Network Power, Hewlett-Packard (HP) Company, International Business Machines (IBM) Corp., Rittal GmbH & Co., Schneider Electric, and Tripp Lite.

London, 15 July 2015: Technavio, an independent tech-focused global research firm, has announced the publication of its market research report on the data center rack market in the US 2015-2019. The introduction of advanced rack-level security is a key trend observed in this market. Rack-level security incorporates the use of video surveillance and biometric modules to protect every rack. This security measure is popular in colocation facilities. Rack-level security is the fourth layer of security in a data center, which can only be accessed by a specific person from the organization.  This market is expected to grow at a CAGR of 13.95% during the forecast period of 2014-2019.

Construction of new facilities and data center renovations together facilitate growth in this market. Recently, it has been noticed that many data centers have started to run out of space due to growing volumes of IT equipment in data centers. This will force data centers to renovate their facilities so as to expand their available space and accommodate more equipment. Also, the advent of racks equipped with mechanical parts to reduce heat generated by servers and storage devices will boost the demand for racks in the US.

“Most vendors in the market are innovating to offer rack cabinets with provisions for cooling systems. These systems can be mounted over or within the racks. Rack cooling systems have a short cooling airflow path and high-precision air direction, which overcomes external constraints,” says Faisal Ghaus, Vice President of Technavio Research.

“These systems can handle high power density equipment and feature high utilization cooling capacities. However, installation requires many small air conditioning devices along with connected piping, specifically at low power density levels.”

To define the market conditions in the next 3-4 years, Technavio analysts have conducted in-depth analysis of the impact of market drivers, challenges, and trends featuring data on product segmentations, vendor shares, growth rate by revenue, and an evaluation of the different buying criteria in the order of importance. 

https://www.technavio.com/%3Cp%3EIf%20you%20are%20interested%20in%20more%…